Heiwa Real Estate REIT, Inc.
Investment Corporation Bond Registration and Inclusive Resolution|May 2026
Heiwa Real Estate REIT Investment Corporation submitted the registration of the issuance of investment corporation bonds on May 21, 2026, and plans to issue up to 100 billion yen of unsecured domestic investment corporation bonds from May 29, 2026, to May 28, 2028. The funds will be used for asset acquisitions, repayments, and other purposes.
Key Figures
- Planned Issuance Amount: 100 billion yen
- Issuance Period: May 29, 2026, to May 28, 2028
- Use of Funds: Asset acquisitions, debt repayment, redemption funds, etc.
AI要約
Funding and Issuance Plan
Heiwa Real Estate REIT Investment Corporation submitted the registration document for the issuance of investment corporation bonds to the Kanto Finance Bureau on May 21, 2026, planning to issue up to 100 billion yen of unsecured domestic investment corporation bonds. The issuance period is from May 29, 2026, to May 28, 2028, and will be carried out in multiple tranches. The funds will be allocated for asset acquisitions, debt repayments, redemptions, repair costs, and operational expenses. No collateral or guarantees will be provided, and the use of funds is diversified.
Details of the Investment Corporation Bonds and Future Outlook
This inclusive resolution allows for the issuance of up to 100 billion yen of investment corporation bonds, providing flexibility in fundraising. The issuance will take place between May 29, 2026, and May 28, 2028, with a minimum unit size of 1 million yen. The funds will primarily be used for asset acquisitions and debt repayments, contributing to future asset management and business expansion.
Heiwa Real Estate REIT Investment Corporation
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