Mitsubishi Electric Corporation
Notice on Conclusion of Basic Agreement to Start Discussions on Business and Management Integration of Mitsubishi Electric’s Power Device Business with ROHM and Toshiba Device & Storage Semiconductor Businesses
Mitsubishi Electric has signed a basic agreement with ROHM, Toshiba, and related companies to integrate the power device and semiconductor businesses and has started discussions.
Key Figures
- Basic Agreement Conclusion Date: 2026年3月27日
- ROHM Capital: 86,969 million yen
- Toshiba Device & Storage Capital: 10,000 million yen
AI要約
Overview of Business and Management Integration
Mitsubishi Electric has signed a basic agreement and commenced discussions with ROHM Co., Ltd., Toshiba Corporation, Japan Industrial Partners, Inc., and TBJ Holdings Co., Ltd. regarding the business and management integration of Mitsubishi Electric's power device business, ROHM's semiconductor business, and Toshiba Device & Storage, a subsidiary of Toshiba's semiconductor business. Through this integration, the aim is to establish a business scale and technological foundation competitive in the global market and contribute to the development of Japan's semiconductor industry.
Future Schedule and Impact
Discussions are still in the early stages, and new disclosures will be made based on future developments. Final contract details will be announced upon conclusion. The implementation is subject to obtaining clearance and approvals under competition laws and other regulations. The impact on consolidated results for the fiscal year ending March 2026 is currently unknown and will be disclosed promptly as necessary.
Mitsubishi Electric Corporation
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