#CapitalInvestment

Capital investment of approximately 55 billion yen to enhance production of about 51 billion yen in liquid cooling modules and about 4 billion yen in air-cooled heat sinks at factories in the Philippines, Thailand, and China. Mass production planned to start from 2026 onward.

Capital investment of 24.1 billion yen to be carried out from 2027 to 2028 to expand production capacity for probe cards for memory.

Shikoku Bank, Ltd. will introduce a restricted stock compensation plan targeting employees enrolled as of May 25, 2026, aiming to enhance corporate value and employee engagement.

The capital investment amount for expanding sponge titanium production capacity has been revised from the initial 33 billion yen to 39 billion yen. The primary causes are rising raw material and labor costs, with completion targeted by fiscal 2027.

Fusso Chemical Industries is investing 40 billion yen in manufacturing facilities for ultra-high purity colloidal silica at its Kyoto plant, scheduled to begin operation in February 2029. Production capacity is expected to increase approximately 20% compared to fiscal 2025.

JX Nippon Mining & Metals has decided on approximately JPY 23 billion in capital investment to increase production capacity of semiconductor sputtering targets at the Hitachinaka new plant to 1.6 times that of fiscal 2023, with sequential operation scheduled from the second half of fiscal 2027.

Ibiden Co., Ltd. announced a capital investment plan of approximately 500 billion yen for its electronics business from fiscal 2026 to 2028 and resolved an additional investment of about 280 billion yen mainly at the Ohno Plant as part of this plan.

FerroTec Corporation plans to invest approximately 5.4 billion RMB (about 12.2 billion JPY) to build a new factory in Beijing, China, and establish three new companies by February 2026 engaged in parts cleaning, metal subcontract processing, and ceramics.

Approximately 20 billion yen additional capital investment to triple InP substrate production capacity by 2030 compared to 2025, with phased operations starting from fiscal 2027.

Plans to invest approximately 500 billion yen from fiscal 2026 through 2028 to expand production capacity of high-performance IC package substrates. Operations expected to start sequentially from fiscal 2027.