SoftBank Group Corp.
Notice Regarding Early Redemption of 2021 Domestic Hybrid Bonds with Deferred Interest Payment Clause
SoftBank Group Corp. will fully redeem early the 5th series of unsecured bonds with deferred interest payment and early redemption clauses totaling 405 billion yen, issued on June 21, 2021, on June 21, 2026.
Key Figures
- Issuance Amount: 40.5 billion yen (issued on June 21, 2021)
- Early Redemption Date: June 21, 2026 (first optional redemption date)
- Interest Rate: 2.750% per annum
AI要約
Overview of Early Redemption
SoftBank Group Corp. has decided to fully redeem early the 5th series of unsecured hybrid bonds with deferred interest payment and early redemption clauses (with subordinated covenants) totaling 405 billion yen, issued on June 21, 2021, on the first optional redemption date of June 21, 2026. The interest rate is 2.750% per annum and the maturity date is June 21, 2056; however, the early redemption will result in repayment ahead of schedule.
Impact on Shareholders and Investors
This early redemption will reduce the company’s hybrid bond liability by 405 billion yen. The redemption amount will be fully repaid at 100 yen per bond, allowing investors to recover the full principal. This may lead to a revision of funding costs and improvement in the financial structure, although no details are provided regarding the use of funds or future financial strategies.
