Akatsuki Corp.
Akatsuki Holdings 60th Unsecured Bond Issuance Notice
Issuing the 60th unsecured bond of 1.0 billion yen. Maturity in one year, interest rate 2.00%, bullet repayment at maturity. Maturity date: September 24, 2027; application period: from August 26, 2026 to September 24, 2026. Funds will be used for the redemption of past unsecured bonds (53rd issue).
Key Figures
- 10 hundred million yen: Bond issuance total amount
- Annual interest rate 2.00%: Interest rate
- September 24, 2027: Redemption date
AI要約
Section heading
This news release announces the decision to issue a new unsecured bond. The募集総額 is 1.0 billion yen, interest rate 2.00%, repayment method is bullet repayment at maturity, maturity date September 24, 2027. Application period is from August 26, 2026 to September 24, 2026; payment date is September 25, 2026. Funds will be used for the redemption of past unsecured bonds.
Section 2 heading
This issuance is part of a capital policy strategy, with no collateral or guarantees; funds usage is for past redemption financing. Note that a net asset maintenance covenant is attached as a financial covenants. Handling is conducted through Akatsuki Securities Co., Ltd. with a domestic general offering.
Akatsuki Corp.
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