OSAKA Titanium technologies Co.,Ltd.
Notice of Determination of Issue Price and Public Offering Price, etc.
The issue price, total amount, paid-in amount, and increase in capital for the issuance of new shares through a public offering and stock offering are disclosed. The issue price for the public offering of new shares is 2,592 yen per share, total amount 18,144,000,000 yen, and the total paid-in amount is 17,388,000,000 yen. The upper limit for third-party allotment is 2,608,200,000 yen, and the maximum increase in capital is 1,304,100,000 yen, with the same amount added to capital surplus. The application period is until September 28, 2026, and the payment deadline is September 29 of the same year. The funds are planned to be used for investment in a sponge titanium manufacturing facility.
Key Figures
- Issue price: 2,592 円
- Total amount: 18,144,000,000 円
- Total paid-in amount: 17,388,000,000 円
AI要約
Capital Policy Overview
This matter aims to raise funds through a public offering of new shares and stock offerings, with an issue price of 2,592 yen per share, a total amount of 18,144,000,000 yen, and a total paid-in amount of 17,388,000,000 yen. The upper limit for new shares issued via third-party allocation is 2,608,200,000 yen, and the maximum increase in capital is 1,304,100,000 yen, with an equal increase in capital surplus. The application period is until September 28, 2026, and the payment date is September 29 of the same year. The funds are expected to be used for investment in sponge titanium manufacturing equipment.
Upcoming Schedule and Use of Funds
The base date for the calculation of the issue price, the offering price, etc., and the discount rate was disclosed on September 1, 2026. The syndicate cover trading period is from September 4 to September 24, 2026. The funds raised this time are expected to be used for capital investment to strengthen sponge titanium production capacity at the headquarters and Amagasaki Factory. For details, please refer to the previous disclosure notice.
Osaka Titanium Technologies Co., Ltd.
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