Lasertec Corporation

6920.T
Semiconductor Equipment & Materials
2026/08/06 Updated
Market Cap: $26.5B (¥4.2T)
Stock Price: $295.95 (¥46,680)
Exchange Rate: 1 USD = ¥157.73

Notice regarding the dividend of surplus (year-end dividend)

Resolved to pay dividend of surplus. Record date 2026/6/30, 197 yen per share, total dividend 17,657 million yen, effective date 2026/9/28. The latest dividend forecast is the same as above; previous year results were 19,300 million yen, year-end dividend 214 yen.

Importance:
Page Updated: August 6, 2026
IR Disclosure Date: August 6, 2026

Key Figures

  • Dividend per share: 197 yen (record-date basis, payment date 2026/9/28)
  • Total dividend: 17,657 million yen (prior year 19,300 million yen)
  • Record date: 2026 年 6 月 30 日

AI要約

Dividend policy and amount

Our profit distribution policy targets a consolidated dividend payout ratio of about 35%, with flexible dividends based on performance. This term's year-end dividend has been decided at 197 yen per share, in line with the latest forecast.

Record date, payment date, and comparison

Record date is June 30, 2026, and the payment date is September 28, 2026. Compared with the same period last year, the totals for dividends per share and total dividend differ from prior-year results; year-end dividend is 214 yen, total 329 yen (prior-year results were 329 yen).

This page uses AI to summarize IR materials from TDnet. Please refer to the original document for investment decisions.

Lasertech Co., Ltd.

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