Ibiden Co.,Ltd.
(Progress Disclosure) Notice Regarding Capital Expenditure for High-Performance IC Package Substrates (Acquisition of Fixed Assets)
Ibiden Co., Ltd. announced a capital investment plan of approximately 500 billion yen for its electronics business from fiscal 2026 to 2028 and resolved an additional investment of about 280 billion yen mainly at the Ohno Plant as part of this plan.
Key Figures
- Total Capital Investment: Approximately 500 billion yen (Three-year plan from fiscal 2026 to 2028)
- Additional Capital Investment: Approximately 280 billion yen (Ohno Plant and existing factories)
- Start of Operations: Sequential operation starting from fiscal 2027, mass production scheduled
AI要約
Overview of Capital Investment Plan
Ibiden Co., Ltd. resolved at the Board of Directors meeting a plan to implement capital investments totaling approximately 500 billion yen in the electronics business over three years from fiscal 2026 to 2028. This disclosure pertains to an additional phase investing around 280 billion yen mainly at the Ohno Plant, aimed at enhancing production capacity of high-performance IC package substrates. This will establish a production system capable of meeting demand for AI servers and high-performance servers.
Future Outlook
This capital investment is scheduled to commence sequential operations and mass production starting in fiscal 2027. The impact on consolidated results for the current term due to this investment is considered minimal. The investment targets include the Ohno Plant and existing factories including overseas sites, and approximately 220 billion yen investment for the Kawama Plant has already been decided.
