Ibiden Co.,Ltd.
Notice Regarding Capital Investment for High-Performance IC Package Substrates (Acquisition of Fixed Assets)
Plans to invest approximately 500 billion yen from fiscal 2026 through 2028 to expand production capacity of high-performance IC package substrates. Operations expected to start sequentially from fiscal 2027.
Key Figures
- Total Capital Investment: Approximately 500 billion yen (Three-year plan from fiscal 2026 to 2028)
- Investment Amount for Kawama Plant: Approximately 220 billion yen (planned)
- Start of Operations: Sequentially from fiscal 2027
AI要約
Overview of Capital Investment Plan
Ibiden Co., Ltd. has resolved a total capital investment of approximately 500 billion yen over three years from fiscal 2026 to 2028 targeting the electronics business in pursuit of achieving its fiscal 2030 goals. The investment primarily aims to increase production capacity of high-performance IC package substrates for AI servers and high-performance servers. Investments will be made into existing factories including the Kawama and Ohno plants as well as overseas plants. Approximately 220 billion yen is allocated for the Kawama plant, with operations expected to commence sequentially from fiscal 2027, followed by mass production.
Outlook
The impact of this capital investment on consolidated results for fiscal 2026 is expected to be minimal. By expanding production capacity, the company aims to meet the increasing demand for high-performance IC package substrates and contribute to the achievement of its medium- to long-term targets by fiscal 2030.
