HPC SYSTEMS Inc.
Notice Regarding Execution of Special Overdraft Agreement
Announced execution of borrowing under a special overdraft agreement to partially fund materials procurement for a large order. Lender: Mizuho Bank, maximum facility 12 hundred million yen, this borrowing amount 2.37 hundred million yen, term 2 years 4 months, no collateral or guarantee. Execution date October 30, 2026, resulting balance 79.75 hundred million yen. Future balance movements will be disclosed as appropriate.
Key Figures
- Borrowing amount under special overdraft agreement: 2.37 hundred million yen
- Maximum facility amount: 120 hundred million yen
- Execution date of this borrowing: 2026-10-30
AI要約
Overview of Financing
This is an additional borrowing under a special overdraft agreement intended to partially fund materials procurement for a large order disclosed on April 2, 2026. The lender is Mizuho Bank, Ltd.; the maximum facility is 120 hundred million yen; the amount borrowed this time is 2.37 hundred million yen; the contract term is 2 years and 4 months; and there is no collateral or guarantee. The execution date is 2026-10-30.
Outlook and Impact
Following this borrowing, the borrowing balance is 79.75 hundred million yen. Future balance movements will be disclosed as appropriate. The funds will be used to partially finance materials procurement related to the large order, and the direct impact on the financial position is described within the scope of this disclosure.
HPC SYSTEMS Inc.
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