EDP Corporation has concluded a joint research agreement with Honda R&D Co., Ltd. on materials for diamond devices. The period runs from 2026-11-01 for three years. Both parties will share responsibilities for developing large wafers and performing quality evaluation, with costs borne by both parties. The project will be incorporated into the medium-term plan, and part of funds obtained through financing will be allocated to it. 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The period runs from 2026-11-01 for three years. Both parties will share responsibilities for developing large wafers and performing quality evaluation, with costs borne by both parties. The project will be incorporated into the medium-term plan, and part of funds obtained through financing will be allocated to it. The immediate impact on near-term results is expected to be minor.","jir_summary":"### Overview and Purpose of the Partnership\nEDP Corporation has entered into a joint development agreement with Honda R&D Co., Ltd. to accelerate R&D of materials for diamond devices. The two companies will share tasks aimed at practical application of large wafers of 2 inches or greater, establishing practical conditions through wafer fabrication and quality evaluation. The contract period is three years starting from 2026-11-01, and joint research costs will be borne by both parties.\n\n### Funding and Future Outlook\nThis fiscal year\u2019s development expenses have been budgeted, and a portion of funds obtained through financing will be allocated to this joint research. Although there may be purchases of equipment, the impact on cash flow is expected to be minor, and results are incorporated into the medium-term management plan. We will promptly disclose any matters that should be disclosed going forward.","jir_financial_highlights":"Joint research period: From 2026-11-01 for three years (Unknown)\nPlanned fund allocation: A portion of funds will be allocated to this joint research (Unknown)\nImpact: Expected to have a minor impact on this fiscal year\u2019s results (Unknown)","jir_category":"","jir_hashtags":"#EDPCorporationPrivate #BusinessPartnership","jir_key_figures":"Joint research period: From 2026-11-01 for three years\nFund allocation: Funds are planned to be allocated to this joint research (specific amount unknown)\nImpact: Expected to have a minor impact on this fiscal year\u2019s results","jir_meta_title":"EDP Corporation Announces Joint Development Agreement with Honda R&D for Diamond Device Materials\uff5c2026","jir_meta_description":"EDP Corporation has concluded a joint development agreement with Honda R&D Co., Ltd. to jointly advance development of large wafers of 2 inches or greater for diamond device materials. The contract period is three years, with costs borne by both parties. The impact on this fiscal year\u2019s results is expected to be minor.","jir_og_title":"EDP Corporation Announces Joint Development Agreement for Diamond Device Materials","jir_og_description":"EDP Corporation has concluded a joint development agreement with Honda R&D Co., Ltd. to collaboratively pursue practical application of large wafers, with costs shared by both parties. The impact is expected to be minor.","jir_og_image_url":"\/assets\/og\/company-general_ir.jpg","jir_chart_data_collection":"[]","ir_related_company":59685,"ir_release_date":"","ir_type":"","ir_is_new":false,"ir_document_url":"","jir_ir_type":"business_update","footnotes":""},"sector":[],"importance":[],"class_list":["post-135769","ir_release","type-ir_release","status-publish","hentry"],"yoast_head":"\n